About Careertakes

👉 Important disclosure: Careertakes is a third-party recruiting platform supporting this hiring process. If selected, you will be employed directly by our client, Engineering.

Applicants for this role may also receive access to additional matched opportunities through the Careertakes platform.

---

Role Overview

This role supports the development and optimization of assembly media and collaterals used in semiconductor packaging. The confidential client is seeking an engineer to design, evaluate, and improve media and collateral solutions to meet quality, reliability, cost, yield, and productivity targets.

• Location: Chandler, AZ (on-site)
• Employment type: Contractor / Full-time
• Shift: Shift 1
• Annual salary range (US): $85,200 — $120,280 USD

---

What You’ll Do

• Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
• Design and implement new media/collateral solutions using design-for-manufacturability principles.
• Apply statistical methods such as Design of Experiments (DOE) and Statistical Process Control (SPC) to characterize and improve processes.
• Plan and execute evaluations under simulated field conditions (heat, humidity, temperature cycling, dynamic forces).
• Lead risk identification and mitigation activities for media and collateral reliability and quality.
• Provide technical consultation to operations and technology teams to align solutions with program milestones.
• Document technical improvements and present findings in papers and presentations.

---

Minimum Qualifications

Minimum qualifications are required to be initially considered for this position.

• Bachelor’s degree in Mechanical Engineering or a related field.
• At least 6 months hands-on experience in one or more of: Equipment Engineering, Mechanical Design, and/or Process Engineering.
• This position is not eligible for immigration sponsorship.

---

Preferred Qualifications

• Experience with mechanical design tools such as SolidWorks or AutoCAD.
• Portfolio demonstrating projects completed from concept to fabrication.
• Familiarity with semiconductor packaging processes and assembly media/collaterals.
• Strong technical and analytical skills; comfortable driving work on complex, time-sensitive projects.
• Experience using DOE and SPC in a manufacturing or lab setting.

---

Compensation & Benefits

• Annual salary range: $85,200 — $120,280 USD (range reflects minimum and maximum target compensation across US locations; actual pay is based on location, skills, experience, and other job-related factors).
• Competitive total compensation package including pay, potential stock bonuses, and benefits (health, retirement, vacation).
• The confidential client adheres to ethical recruiting practices and will not charge fees during hiring.

---

Work Model

• This role requires an on-site presence in Chandler, AZ.
• Shift 1 (United States of America).

---

Legal & Hiring Notes

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, age, disability, veteran status, pregnancy, gender identity or expression, sexual orientation, or any other characteristic protected by law.

---

Equal Opportunity & Hiring Transparency

Careertakes and our client are Equal Opportunity Employers committed to building a diverse and inclusive workforce. We prohibit discrimination or harassment of any kind. To support a fair and efficient hiring process, AI tools may be used to assist with application review or resume screening. These tools do not replace human decision-making. Final hiring decisions are made by people.

If you have questions about how your data is used, please contact us directly.