About Careertakes

👉 Important disclosure: Careertakes is a third-party recruiting platform supporting this hiring process. If selected, you will be employed directly by our client, Engineering.

Applicants for this role may also receive access to additional matched opportunities through the Careertakes platform.

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What You’ll Do

Confidential Client is seeking an early-career Silicon Packaging Design Engineer to drive substrate and package layout work from concept through tape-out. You will collaborate with silicon, package, and board teams to deliver manufacturable, high-performance substrate designs that meet cost, signal-integrity, and mechanical requirements.

• Drive physical layout and routing of package designs to meet silicon, package, and board performance targets
• Perform substrate fit and routing studies and document design / performance / cost trade-offs
• Define and implement substrate design rules and participate in internal and external design reviews
• Analyze results, resolve Design Rule Checks (DRCs), and optimize designs for manufacturability and yield
• Work cross‑functionally to optimize pinouts and silicon–package–board interactions
• Produce and maintain required documentation and collateral in the product lifecycle management system

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Behavioral Traits

• Proactive problem solver who drives results
• Strong verbal and written communication for cross‑team collaboration
• Able to manage multiple priorities and meet tight deadlines

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Minimum Qualifications

Minimum qualifications are required to be initially considered for this position.

• Bachelor’s degree plus 1+ year experience, or Master’s degree plus 6 months experience in Electrical Engineering, Mechanical Engineering, or Materials Science
• 6+ months experience (academic, internship, or professional) with microelectronic package or PCB physical layout design and manufacturing processes
• Familiarity with package design tools such as Siemens Xpedition, Cadence Allegro Package Design, AutoCAD, or SolidWorks
• Understanding of physical layout aspects of substrate design (custom layouts, floor plans, schematic-to-layout workflows)

Note: This position is not eligible for immigration sponsorship.

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Preferred Qualifications

• Experience in microelectronic package substrate design, package I/O routing, or related technology development
• Familiarity with electrical modeling and simulation tools (PowerDC, HyperLynx, Q3D, HFSS)
• Experience with automation and package layout tools (PLA, FIELD)
• Scripting experience (Python, VB, C, or similar)

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Compensation & Benefits

• Annual salary range (US): $105,650.00 – $149,150.00 USD
• Confidential Client offers competitive total compensation including pay, potential equity/stock bonuses, and benefits (health, retirement, paid time off). Actual pay within the posted range will be determined by location, skills, experience, and education.

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Work Model & Location

• This role requires on-site presence in Chandler, Arizona (Chandler, AZ). Remote work is not available for this position.
• Shift: Shift 1

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Employment Type

• Contract
• Full time
• Targeted for recent college graduates / early-career engineers

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Legal & Hiring Notes

• All qualified applicants will receive consideration without regard to legally protected characteristics.
• Confidential Client follows ethical recruiting practices and does not charge applicants any fees during hiring.
• If you have questions about accommodations during the hiring process, please let the recruiter know.

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Equal Opportunity & Hiring Transparency

Careertakes and our client are Equal Opportunity Employers committed to building a diverse and inclusive workforce. We prohibit discrimination or harassment of any kind. To support a fair and efficient hiring process, AI tools may be used to assist with application review or resume screening. These tools do not replace human decision-making. Final hiring decisions are made by people.

If you have questions about how your data is used, please contact us directly.