About Careertakes

👉 Important disclosure: Careertakes is a third-party recruiting platform supporting this hiring process. If selected, you will be employed directly by our client, Engineering.

Applicants for this role may also receive access to additional matched opportunities through the Careertakes platform.

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Overview

Confidential Client is hiring a Module Engineer On-Shift (MEOS) for Night Shift (Shift 4) at its Chandler, AZ manufacturing site. This is an on-site, hands-on manufacturing role that supports 24x7 lot movement in semiconductor substrate/packaging production. The role requires troubleshooting, shift communication, documentation, and collaboration with equipment and process owners.

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Key Responsibilities

• Provide hands-on, real-time factory-floor support for equipment, process, and product issues to maintain continuous lot movement.
• Perform troubleshooting, error recovery, and lot disposition activities to minimize downtime.
• Receive and deliver comprehensive shift pass-downs; align priorities with management at shift start.
• Execute inspection, imaging, and non-standard procedures to collect development and process data.
• Write and update process specifications and RFCs (Request for Change) to keep documentation current.
• Communicate clearly with Tool and Lot Owners and other stakeholders via email and shift briefings.
• Support new tool enables and perform ad-hoc duties as required within your functional area.

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Shift & Schedule

• Shift: Shift 4 — Night Shift (6:00 PM – 6:00 AM)
• Schedule: Alternating 3- and 4-day work weeks (Sunday–Tuesday, with alternating Saturdays)

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Minimum Qualifications

• Bachelor’s degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline with 1+ years of relevant industry experience; OR
• Master’s degree in the disciplines above.

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Preferred Qualifications

• Hands-on experience in semiconductor packaging or packaging substrate manufacturing.
• Experience applying Statistical Process Control (SPC) methodologies in a manufacturing environment.
• Strong troubleshooting skills and familiarity with factory-floor error recovery processes.
• Clear written and verbal communication skills and a collaborative, team-oriented attitude.
• Ability to work independently on a fast-paced production line and adapt to shifting priorities.

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Compensation & Employment Type

• Employment type: Full time / Contractor (dependent on assignment)
• Annual pay range (US, Arizona): $85,200 — $139,810 (range reflects target compensation for the Arizona location; actual pay will be based on skills, experience, and qualifications)

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Work Model & Location

• This role requires on-site presence at the Chandler, Arizona facility (no remote work).

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Why Join

• Work on advanced substrate packaging technology in a high-impact manufacturing environment.
• Gain hands-on experience with semiconductor packaging processes and cross-functional problem solving.
• Competitive total compensation package, benefits, and opportunities for professional growth.

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Equal Opportunity & Hiring Transparency

Careertakes and our client are Equal Opportunity Employers committed to building a diverse and inclusive workforce. We prohibit discrimination or harassment of any kind. To support a fair and efficient hiring process, AI tools may be used to assist with application review or resume screening. These tools do not replace human decision-making. Final hiring decisions are made by people.

If you have questions about how your data is used, please contact us directly.